IICIE

2026 Shenzhen International IC Innovation Expo (IICIE)
Date: September 9–11, 2026
Venue: Shenzhen World Exhibition & Convention Center (Bao'an New Hall), No. 1 Zhancheng Road, Fuhai Sub-district, Bao'an District, Shenzhen, China
Organizers: China Communications Industry Association, Shenzhen Herong Zhongxin Exhibition Co., Ltd.
Frequency: Annual
Exhibition Area: 60,000 sqm
Visitors: 60,000
Exhibitors and Brands: 1,100

Chips: AI chips, communication chips, memory chips, CPU chips, sensor chips, analog chips, digital chips, power management and power chips, RF chips, driver chips, etc.;
Design/Manufacturing Services: IP/EDA (Electronic Design Automation), Fabless (fabless semiconductor design), Foundry (wafer fabrication), OSAT (assembly and packaging test), testing services, etc.;
Semiconductor Equipment: manufacturing equipment, packaging equipment, inspection and testing equipment, assembly equipment, environmental treatment equipment, factory automation/robots, etc.;
Semiconductor Materials: substrate materials, manufacturing materials, packaging materials, etc.;
Semiconductor Core Components: sealing rings, precision bearings, metal components, quartz/silicon/SiC/ceramic components, power supplies (RF power, DC power, plasma power, etc.), stepper motors, motion control, servo motors, pumps / semiconductor valves / pressure, electrostatic chucks, flow meters, machine vision, sensors, linear motors, etc.;
Wide Bandgap Semiconductors and Power Devices: silicon carbide, gallium nitride, diamond, gallium oxide, cubic boron nitride, aluminum nitride, graphite and carbon materials, power devices, etc.;