elexcon

2026 Shenzhen International Embedded Systems Exhibition (elexcon)
Exhibition Dates: September 9–11, 2026
Venue: Shenzhen World Exhibition & Convention Center (Bao'an New Hall), No. 1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen, China
Organizer: Bowin Creative Exhibition (Shenzhen) Co., Ltd.
Frequency: Annual
Exhibition Area: 30,000 sqm
Visitors: 60,000
Exhibitors/Brands: 600

Embedded Systems & AIoT: Embedded AI, Edge Computing, MCU/MPU, RISC-V Zone, RTOS/Operating Systems & Development Boards.
Chips & Semiconductors: SoC, Memory, Sensors, Signal Chain, Distributors & E-commerce Platforms.
Power Supply & Power Semiconductors: Third-generation Semiconductors (GaN/SiC), Power Management IC, Energy Storage Technology & Carbon Neutrality Solutions.
Automotive Electronics Technology: Automotive-grade Chips, Intelligent Cockpit, Autonomous Driving Perception Solutions & Automotive High-speed Connectors.
SiP & Advanced Packaging & Testing: Chip-level and System-level Packaging Technologies, Advanced Production Equipment & Test & Measurement Tools.
Electronic Components & Materials: Passive Components, PCB, High-speed Connectors, Wire Harnesses & New Electronic Materials.