elexcon

elexcon 2026 (Shenzhen International Electronics Exhibition)
Dates: September 9–11, 2026
Venue: Shenzhen World Exhibition & Convention Center (Bao’an New Hall), No. 1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen, China
Organizer: BOWEN Creative Exhibition (Shenzhen) Co., Ltd.
Frequency: Annual
Exhibition Area: 30,000 sqm
Visitors: 60,000
Exhibitors & Brands: 800

Electronic Components: semiconductor components, RF chips/filters/amplifiers, passive components (resistors, capacitors, inductors, etc.), discrete components, optoelectronic components, crystals/oscillators/clock chips, power management ICs, power devices/SiC/GaN, protection devices, MEMS micro/nano systems, sensors, test and measurement, testing and certification, tools, displays, connectors/harnesses, relays, switches, structural components, PCBs, new electronic materials. Embedded: embedded and on-device AI, edge AI computing platforms, AI industrial computers, embedded processors/SoC/MCU/MPU, high-performance computing processor core boards, high-speed storage, RISC-V and open source, smart displays/HMI, industrial power supplies, wireless communication, operating systems, software and tools, other components, solutions, etc. Power and Energy Electronics: power management ICs, digital power, power semiconductors, SiC/GaN, resistors/capacitors/inductors, magnetic components/materials, electromagnetic compatibility (EMC), power modules, power supply testing, PV-storage-charging, power supplies for data centers and communications, power semiconductor components, BMS/PCS/EMS and other components, etc. Specially invited over 300 technical and management personnel from the energy storage, server and data center, and digital energy sectors in South China for procurement and exchange.